Indiumphosphid-Trennung mit endlosen Diamantdrahtsägen: Spanungsgesteuerte Wafer-Trennung für Photonik
An InP boule cracks along its {110} cleavage plane the moment lateral force exceeds what the crystal can absorb. When that happens inside a wire cut, the result is not a slow degradation of quality — it is a scrap wafer. Edge chipping, hidden sub-surface cracks that only show up after lapping, or a full









