Large-Scale Systems
- Equipment up to 2.5m cutting capacity
- Multi-station automated production lines
- Integration with existing factory systems
Complete Software Development
- Custom control systems
- Process optimization algorithms
- Remote monitoring and diagnostics
Rapid Prototyping
- 3D modeling and simulation
- Quick prototype manufacturing
- Fast iteration based on your feedback
Direct Engineering Support
- One-on-one consultation with our design team
- Site visits for complex installations
- Ongoing technical partnership
Precision Wire Cutting
Optical And Semiconductor Materials
Need a Custom Solution?
Ingot Cropping, Sectioning and Test Slices
- Max Workpiece Length (mm):2000
- Max Workpiece Dia (mm):600
- Set Differet Section Length
- Can be Customized
- Made for Si ingot
Vertical Tabletop Wiresaw
Oscillating Multi-wire Cutting Machine
- Max Workpiece Length (mm):380
- Max Workpiece Width (mm):160
- Max Workpiece Height (mm):150
- Swinging Cutting Technology
- Inverted Cutting Technology
Oscillating Diamond Wire Saw
- Max Workpiece Length (mm):200
- Max Workpiece Width (mm):200
- Max Workpiece Height (mm):200
- Swinging Cutting Technology
- 360° Rotation Cutting Technology
Slice + Rotate + Tilt all in One
- Max Workpiece Length (mm):200
- Max Workpiece Width (mm):200
- Max Workpiece Height (mm):150
- Rotate Cutting Technology
- Tile Cutting Technology
QUARTZ GLASS WIRE CUTTING MACHINE
- Max Workpiece Dia (mm): 600
- Max Workpiece Height (mm):400
- Rotate Cutting Technology
- Horizontal Cutting Technology
- Siemens System
Graphite Complex Profile Cut
Recent ProjectOptical Glass Cutting
Recent ProjectJade/ hard Stone Slicing
Recent ProjectSilicon Ingot Cropping
Recent ProjectGraphite Wafer Slicing
Recent ProjectQuartz Lump Cut
Recent ProjectUltra Huge Quartz Cut
Recent ProjectSpecial-shaped Infrared Lens Cut
Recent ProjectWhy Leading Companies Choose Vimfun:
🏆 Proven Industrial Expertise
- 20+ years in precision equipment manufacturing
- Pioneer in endless diamond wire technology since 2019
- Serving aerospace, semiconductor, optical, and automotive industries
- Technical Trends
- levy
We received a large silicon wafer from a customer who needed several smaller circular wafers cut from it. We ran the cutting test on our SGI 20 CNC Contour Cutting Machine, using a drawing that combined two wafer sizes. The test produced 13 smaller wafers from the original piece. In
- Technical Trends
- levy
A VIMFUN SVI 120-60 endless diamond wire saw. An isostatic graphite block the customer sent us. Two tests on the same machine, same wire, same clamp — slicing, then contour cutting. Both functions have to pass before the machine ships. That is the whole point of the Factory Acceptance Test.
- Technical Trends
- levy
A solid fused quartz block. The task is to cut a defined contour through the block, lift the inner shaped part out intact, and leave the surrounding material usable — not fractured, not chipped along the inner wall, not with microcracks propagating back into the parent block. This is not
Frequently Asked Questions
Answers to common questions from engineers and purchasing managers worldwide.
Cutting machines: No MOQ. A single unit can be ordered, with custom configurations available on request.