Cutting SmCo and Ferrite Magnets with Diamond Wire
2026-05-23
SmCo magnets crack without warning. We’ve had a customer send us a batch of Sm2Co17 arc segments — 40 pieces total — and ask why their blade saw was destroying
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Hard Metal Cutting with Diamond Wire Saw — Titanium, Tungsten, and Molybdenum
2026-05-21
Hard metal cutting is where most conventional tools fail fast. Titanium alloys, tungsten, and molybdenum share a reputation that anyone who’s machined them knows well: they destroy tooling. Ti-6Al-4V eats
Magnet Cutting Coolant: Oil vs Water for Wire Sawing
2026-05-15
Pick the wrong coolant for magnet cutting and you’ll know within hours. On NdFeB, water-based coolant turns a freshly cut surface grey with Nd(OH)₃ corrosion. On ferrite, oil-based coolant creates
NdFeB Magnet Cutting Process Using Endless Diamond Wire
2026-05-06
Sintered NdFeB is one of the hardest permanent magnet materials to cut cleanly. The grain boundaries are brittle, the Nd-rich phase oxidizes fast when exposed to moisture, and any thermal
Cutting Diamond Wire Speed
2026-04-26
Most engineers setting up their first diamond wire cut ask the same question: how fast should the wire run? The short answer — for most hard and brittle materials, somewhere
Loop Alignment and Vibration Control in Diamond Wire Saw Systems
2026-04-24
We spent three days debugging a cutting line that was producing wafers with a periodic waviness — clean cuts for 80% of the wafer surface, then a recurring ridge pattern
Loop Fatigue Test and Service Life of Diamond Wire Loops
2026-04-23
A customer cutting sapphire wafers contacted us two months into production for technical support: his wire life had dropped from the 150 hours we’d specified to about 80 hours. We
Loop Manufacturing Process: Endless Diamond Wire Loops
2026-04-18
A customer once asked us why two visually identical diamond wire loops — same diameter, same diamond grit size, same advertised tension rating — gave them wildly different cutting results.
Tension Distribution and Fatigue in Diamond Wire Loop Systems
2026-04-17
We had a cutting line producing 300μm silicon wafers with ±25μm TTV — three times the spec limit. The operator swore the wire was defective. Static bench testing showed the
Principles of the Diamond Wire Cutting Process
2026-04-15
We spent the first six months with our wire saw convinced that faster wire speed always meant faster cuts. Then we ran a batch of sapphire wafers at 70 m/s and watched