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Introduction In micro abrasive wire cutting, the characteristics of the abrasive layer strongly determine cutting precision, kerf width stability, surface integrity, and subsurface damage. Among all parameters influencing abrasive wire performance, diamond grit size is one of the most critical. When processing brittle and high-value materials such as sapphire, silicon carbide (SiC), quartz, advanced ceramics,

Maintaining a wire cutting machine is not only about replacing the wire. True cutting stability comes from a systematic approach that considers the condition of the wheels, groove wear, wire tension performance, and the cleanliness of key mechanical components. When operators follow a consistent maintenance checklist, wire cutting systems achieve higher uptime, stronger cutting stability,

Process Optimization in Fine Wire Cutting Wire cutting—especially when dealing with brittle, hard, or high-value materials—relies on achieving a balance between feed speed, wire tension, vibration control, and abrasive interaction. As industries shift toward thinner substrates, higher precision, and lower allowable kerf loss, cutting optimization has become a critical engineering discipline. Modern fine wire cutting