Wire Saw

DIamond Multi Wire Saw for Silicon Wafer

  • Max Workpiece Length (mm): 490
  • Max Workpiece Width (mm): 300
  • Max Workpiece Height (mm): 300

Oscillating Multi-wire Cutting Machine

  • Max Workpiece Length (mm):380
  • Max Workpiece Width (mm):160
  • Max Workpiece Height (mm):150
  • Swinging Axis: Workpiece can swing while cutting
  • Inverted Cutting Technology
  • Multi- wire Cutting
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