SGRT20

The Vimfun SGRT-20 Multi-Axis Diamond Wire Saw is designed for precision cutting of hard and brittle materials that require high accuracy, complex angles, and crystal orientation control.

By combining slicing, rotary machining, and tilt-angle cutting, the SGRT-20 provides exceptional flexibility for processing advanced materials used in high-tech industries.

Semiconductor Materials Industry

The SGRT-20 is highly suitable for cutting semiconductor materials such as silicon carbide (SiC), silicon, and compound semiconductor crystals.

These materials often require precise orientation cutting and wafer slicing, where the crystal direction must be accurately controlled. The rotary and tilt axes of the SGRT-20 enable precise adjustment of cutting angles, ensuring accurate wafer preparation and minimizing material loss.

Typical applications include:

• SiC boule slicing

• wafer orientation cutting

• semiconductor crystal preparation

Sapphire Processing Industry

Sapphire is widely used in LED substrates, optical windows, and precision components. Cutting sapphire often requires specific crystal orientations such as C-plane, A-plane, or R-plane.

The SGRT-20 allows flexible angle adjustment through its multi-axis system, making it ideal for sapphire boule slicing and orientation cutting while maintaining excellent surface quality.

Typical applications include:

• sapphire crystal slicing

• LED substrate preparation

• sapphire orientation cutting

Optical and Laser Crystal Industry

Many optical and laser crystals require high-precision cutting with strict orientation control to maintain optical performance.

The SGRT-20’s stable cutting mechanism and multi-axis capability make it suitable for machining materials such as YAG, YVO4, BBO, KTP, and lithium niobate crystals.

Typical applications include:

• laser crystal cutting

• optical prism machining

• crystal orientation processing

Advanced Ceramics Industry

Advanced ceramics such as alumina (Al₂O₃), zirconia (ZrO₂), and silicon nitride (Si₃N₄) are widely used in aerospace, electronics, and precision engineering.

These materials are extremely hard and brittle, requiring stable cutting processes with minimal mechanical stress. The SGRT-20 provides smooth and controlled cutting that helps prevent cracking or chipping.

Typical applications include:

• ceramic component slicing

• precision ceramic machining

• ceramic substrate cutting

Optical Glass and Quartz Industry

The SGRT-20 can also be used to machine optical glass, fused silica, and quartz, which are widely used in optical systems and photonics applications.

The multi-axis cutting capability allows the machine to produce complex optical components such as prisms and angled parts with high accuracy.

Typical applications include:

• optical prism cutting

• quartz component machining

• precision optical part fabrication

Why Multi-Axis Cutting Matters

Many advanced materials require more than simple straight slicing. The ability to rotate and tilt the workpiece during cutting allows manufacturers to achieve precise crystal orientation, complex angles, and higher machining flexibility.

The SGRT-20 Multi-Axis Diamond Wire Saw provides this capability in a single integrated system, making it an ideal solution for research institutes, semiconductor manufacturers, and precision material processing companies.