Large-Scale Systems

  • Equipment up to 2.5m cutting capacity
  • Multi-station automated production lines
  • Integration with existing factory systems

 Complete Software Development

  • Custom control systems
  • Process optimization algorithms
  • Remote monitoring and diagnostics

 Rapid Prototyping

  • 3D modeling and simulation
  • Quick prototype manufacturing
  • Fast iteration based on your feedback

 Direct Engineering Support

  • One-on-one consultation with our design team
  • Site visits for complex installations
  • Ongoing technical partnership

Need a Custom Solution?

Our engineering team is ready to discuss your specific requirements.

Graphite Complex Profile Cut

Recent Project

Optical Glass Cutting

Recent Project

Jade/ hard Stone Slicing

Recent Project

Silicon Ingot Cropping

Recent Project

Graphite Wafer Slicing

Recent Project

Quartz Lump Cut

Recent Project

Ultra Huge Quartz Cut

Recent Project

Special-shaped Infrared Lens Cut

Recent Project

Why Leading Companies Choose Vimfun:

 

🏆 Proven Industrial Expertise

  • 20+ years in precision equipment manufacturing
  • Pioneer in endless diamond wire technology since 2019
  • Serving aerospace, semiconductor, optical, and automotive industries
Vimfun Diamond Wire Saw Machine
Vimfun endless diamond wire loop

Introduction Fine cutting wires are critical functional components in precision slicing systems used for hard and brittle materials such as sapphire, silicon carbide, advanced ceramics, optical glass, and high-purity quartz. Unlike conventional cutting tools, the performance of a fine cutting wire is not defined solely by its diameter or tensile

1. Introduction Diamond wire saw cutting technology is widely used for precision cutting of brittle and hard materials where minimal kerf loss, stable cutting forces, and controlled surface quality are required. Compared with blade-type cutting tools, diamond wire saws generate lower mechanical stress, allowing effective slicing of silicon, quartz, ceramics,

abrasive coating materials diagram

Introduction In micro abrasive wire cutting, the characteristics of the abrasive layer strongly determine cutting precision, kerf width stability, surface integrity, and subsurface damage. Among all parameters influencing abrasive wire performance, diamond grit size is one of the most critical. When processing brittle and high-value materials such as sapphire, silicon

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