Large-Scale Systems
- Equipment up to 2.5m cutting capacity
- Multi-station automated production lines
- Integration with existing factory systems
Complete Software Development
- Custom control systems
- Process optimization algorithms
- Remote monitoring and diagnostics
Rapid Prototyping
- 3D modeling and simulation
- Quick prototype manufacturing
- Fast iteration based on your feedback
Direct Engineering Support
- One-on-one consultation with our design team
- Site visits for complex installations
- Ongoing technical partnership
Need a Custom Solution?
QUARTZ GLASS WIRE CUTTING MACHINE
- Max Workpiece Dia (mm): 600
- Max Workpiece Height (mm):400
3D TAPER CUT ENDLESS DIAMOND WIRE SAW MACHINE
- Max Workpiece Length (mm):600
- Max Workpiece Width (mm):600
- Max Workpiece Height (mm):600
Swinging Diamond Wire Cutting Equipment
- Max Workpiece Length (mm):400
- Max Workpiece Width (mm):400
- Max Workpiece Height (mm):375
BIG SIZE QUARTZ CUTTING WIRE SAW MACHINE
- Max Workpiece Dia (mm):2000
- Max Workpiece Height (mm):600
Ultra-huge Diamond WIre Saw
- Max Workpiece Length (mm): 2500
- Max Workpiece Width (mm): 800
- Max Workpiece Height (mm): 800
Best Seller Graphite Wire Saw
- Max Workpiece Length (mm): 800
- Max Workpiece Width (mm): 800
- Max Workpiece Height (mm): 800
CNC Glass Cutting Wire Saw
- Max Workpiece Length (mm):200
- Max Workpiece Width (mm):200
- Max Workpiece Height (mm):200
Graphite Cutting Wire Saw Machine
- Max Workpiece Length (mm):600
- Max Workpiece Width (mm):600
- Max Workpiece Height (mm):600
CNC contour cutting machine
- Max Workpiece Length (mm):200
- Max Workpiece Width (mm):200
- Max Workpiece Height (mm):250
Wire Slicer, Diamond Wire Saw
- Max Workpiece Length (mm): 400
- Max Workpiece Width (mm): 400
- Max Workpiece Height (mm):350
Why Leading Companies Choose Vimfun:
🏆 Proven Industrial Expertise
- 20+ years in precision equipment manufacturing
- Pioneer in endless diamond wire technology since 2019
- Serving aerospace, semiconductor, optical, and automotive industries
- Technical Trends
- levy
Introduction: Moving Beyond Band Saws and Cutting Discs In the precision manufacturing of expensive hard materials—such as Silicon Carbide (SiC), Sapphire, and Magnetic Materials—the “Pre-processing” stage (cropping and sampling) has historically been dominated by blunt tools. Manufacturers often use Diamond Band Saws or ID Cutting Discs to crop ingots. While
- Technical Trends
- levy
Introduction: The Physics of “Stop-and-Go” vs. Continuous Flow In the precision cutting industry, the definition of “efficiency” is context-dependent. For the mass production of silicon wafers, efficiency is defined by volume—cutting 500 wafers simultaneously. This is the undisputed territory of Multi-wire Reciprocating Saws. However, as the industry pivots toward harder
- NEWS & INSIGHTS
- bianji
Over time, the way glass is cut has changed a lot. In the past, workers used heavy and rough tools. The tools weren’t very fast. They also made trash and broken things. Newer wire saw models are much better. These are clean. The feel is smooth. You can easily control