細線ワイヤによる脆性材料の切断ガイド
Introduction Cutting brittle materials requires a process that minimizes stress concentration, thermal gradients, and vibration. Materials such as sapphire, quartz, ceramics, silicon carbide, and high-purity glass respond poorly to traditional cutting tools. Excessive mechanical load or heat can introduce micro-cracks, edge chipping, or subsurface fracture—problems that become more severe as components become thinner and more […]