부과

In traditional diamond wire cutting processes, operators have historically relied on years of experience, intuition, and manual observation to adjust cutting parameters. However, this “black box” operational model is rapidly becoming obsolete, especially as industries machining silicon carbide (SiC), sapphire, and quartz demand stricter micron-level tolerances. Modern manufacturing requires “white box” transparency—monitoring every critical parameter […]

Diamond wire cutting is widely recognized and marketed as a “cold cutting” technology, an attractive premise for processing brittle and heat-sensitive materials. However, this terminology presents a fundamental engineering paradox. While the macroscopic bulk temperature of the workpiece remains relatively low, the microscopic reality at the abrasive-workpiece interface is drastically different. In fact, localized contact