Anwendungen des Feindrahtschneidens in der Präzisionsfertigung

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Introduction: Moving Beyond Band Saws and Cutting Discs

In the precision manufacturing of expensive hard materials—such as Silicon Carbide (SiC), Saphirund Magnetic Materials—the “Pre-processing” stage (cropping and sampling) has historically been dominated by blunt tools. Manufacturers often use Diamantbandsägen oder ID Cutting Discs to crop ingots.

While these tools are robust, they are wasteful. A typical band saw or cutting disc has a thickness of 1.0mm to 1.5mm. When cutting a material worth thousands of dollars per kilogram, turning 1.5mm of it into dust with every cut is a massive financial loss.

Dies ist der Ort, an dem Endless Loop Diamond Wire Slicing enters as the superior alternative. By utilizing a high-strength endless wire with a diameter of 0.30mm – 0.35mm, manufacturers can achieve a “Fine Wire” cut compared to traditional blades.

This article explores how replacing traditional thick blades with 0.35mm endless wire technology significantly reduces Kerf Loss, improves surface geometry, and accelerates the cropping process.


1. Defining “Fine” in Heavy Processing: The 0.35mm Advantage

In the context of ingot cropping and heavy block squaring, “Fine Wire” is defined relative to the tools it replaces.

The Comparison

  • Traditional Tool: Diamond Band Saw / Cutting Disc.
    • Die Dicke: 1.0mm – 1.5mm
    • Kerf Loss: High
  • Vimfun Endless Wire: High-Strength Loop.
    • Durchmesser: 0.30mm – 0.35mm
    • Kerf Loss: Low (< 0.4mm)

The Engineering Logic

While reciprocating wafering saws use ultra-fine wires (0.15mm) for mass production, they are too slow and delicate for heavy Ingot Cropping (cutting off the head/tail of a boule).

Vimfun’s 0.35mm Endless Wire strikes the perfect balance:

  1. Robustness: Strong enough to cut through 6-inch or 8-inch SiC ingots rapidly without breaking.
  2. Economy: Thin enough to save ~1mm of material per cut compared to a band saw. On a 6-inch SiC ingot, saving 1mm of length is equivalent to saving 2-3 wafers.

2. Application I: SiC Ingot Cropping (Replacing Band Saws)

The most impactful application of 0.35mm endless wire is in the Cropping (Top/Tail Removal) of semiconductor ingots.

The Old Way: Band Saws

Band saws rely on a thick steel band coated with diamonds. They vibrate significantly and leave a wide kerf. The cut surface often has a “wavy” pattern requiring heavy grinding to flatten.

The New Way: Endless Wire Slicing

Using a Vimfun machine with a 0.35mm endless loop:

  • Material Savings: Reducing the cut width from 1.2mm to 0.4mm saves roughly 60-70% of the material usually lost to dust.
  • Surface Geometry: The high linear speed (60 m/s) and stable tension create a mirror-smooth, flat surface.
  • Downstream Benefit: Because the cropped face is flatter (TTV < 0.02mm), the ingot requires less face-grinding before it is mounted for mass wafering. This saves both material and processing time.

3. Application II: Precision Sampling & QC (Replacing Discs)

In Quality Control (QC) labs, speed and sample integrity are paramount.

The Challenge of Cutting Discs

Cutting discs (Inner Diameter or Outer Diameter saws) exert high normal forces. When cutting brittle materials like Neodymium Magnets oder Glas, this force can cause edge chipping or micro-cracks.

The Endless Wire Solution

A 0.3mm – 0.35mm endless wire cuts with low cutting force.

  • No Edge Chipping: The wire acts like a fast-moving abrasive string, gently grinding through the material rather than forcing its way through. This is critical for inspecting crystal defects where the cutting process itself must not introduce damage.
  • Safety & Cleanliness: Unlike spinning discs which can shatter, diamond wire is safer. It also carries coolant effectively into the cut, preventing thermal damage to the sample structure.

4. Application III: Magnetic Material Segmentation

Für NdFeB (Neodymium Iron Boron) magnet production, blocks must be squared and segmented.

  • Abfallreduzierung: Rare earth materials are expensive. Replacing a 1.0mm blade with a 0.35mm wire instantly increases the yield of the raw magnetic block.
  • Komplexe Formen: Unlike a rigid disc or band saw that can only cut straight lines, endless wire machines offer more flexibility for processing various block sizes without changing tools.

5. Economic Analysis: Band Saw vs. Endless Wire

The following table calculates the savings when cropping a 6-inch (150mm) Silicon Carbide Ingot.

Comparison MetricTraditional Diamond Band SawVimfun Endless Loop WireImpact
Tool Thickness~ 1.2 mm0.30 mm – 0.35 mm3x Thinner
Kerf Loss (Material Lost)High (~ 1.3 mm)Low (~ 0.4 mm)Save ~0.9mm / cut
Material Saved Value$0Hundreds of $$ per cutHigh ROI
Surface FlatnessPoor (Wavy)Excellent (Flat)Less Grinding
Coolant AccessPoor (Blade blocks fluid)ExzellentNo Thermal Damage

ROI Note: Saving 0.9mm of SiC crystal length allows for approximately 2 extra wafers to be produced from the same ingot.


6. Why 0.35mm is the “Sweet Spot” for Endless Loops

You might ask: “Why not go thinner, like 0.15mm?”

In Endlosschleife technology, the wire forms a closed circle. The joint (or welding point) and the drive mechanism require a certain wire diameter to maintain high tensile strength for high-speed operation (60 m/s).

  • 0.35mm provides the durability needed to cut ultra-hard materials at high speeds without frequent breakage.
  • It is the perfect compromise: Thin enough to offer massive savings over band saws, but strong enough to offer reliability that fragile 0.15mm reciprocating wires cannot match in single-wire cropping scenarios.

Abschluss

Fine Wire Slicing in the context of heavy industrial processing means moving away from the “brute force” of 1mm band saws to the “precision” of 0.35mm Endless Diamond Wires.

For applications like Ingot Cropping, Block Squaringund QC Sampling, Vimfun’s technology offers a clear economic advantage: it stops turning valuable material into dust. By upgrading to endless wire slicing, manufacturers effectively generate free material with every cut, improving yield and surface quality simultaneously.

To see how upgrading from band saws to 0.35mm endless wire can improve your process, explore our Diamantdrahtsägen.

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