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다이아몬드 와이어 커팅

Cold and Precise Processing for Brittle Materials

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What Is Diamond Wire Cutting?

Diamond wire cutting is an advanced, non-thermal process that uses a thin, 다이아몬드 코팅 와이어 to slice through hard and brittle materials with precision. It’s an abrasive cutting method, where the diamond grains on the wire remove material by grinding, rather than traditional cutting or shearing methods.

Unlike EDM (Electrical Discharge Machining), which relies on thermal energy to cut materials, 다이아몬드 와이어 커팅 avoids heat generation, making it ideal for materials that are sensitive to temperature changes, such as silicon, 사파이어및 광학 유리.

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Diamond wire cutting solutions

Diamond wire cutting can be classified into two types of systems:

Spool Wire Cutting (Reel-type)

1,Multi-wire systems typically use 50–200 wires simultaneously. These systems are used for high-volume cutting, such as slicing silicon wafers for the semiconductor industry.
2, Single-wire systems can be used for specific or precision cuts but require more time to slice through materials.

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Endless Wire Cutting (Loop-type)

1, Multi-wire systems usually operate with 3–5 wires for cutting tasks, offering higher cutting speeds than reel systems. They are primarily used for precision tasks like cutting sapphire or optical glass, where high cutting speed and low thermal impact are essential.
2, Single-wire systems in loop-type saws are more compact and simpler to operate but are limited by the radius size of the cutting parts. They can handle inner cutouts with a radius greater than 1.5 mm but cannot cut tight curves or internal holes as easily as reel-type systems.

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Key Differences: Reel vs Loop Wire Systems

기능	Reel (Spool)	Loop (Endless)
Wire Quantity	50–200 wires running simultaneously	3–5 wires for faster cutting speeds
절단 속도	Slower, suitable for bulk processing	Faster, ideal for precision and speed
커팅 범위	Can cut inner holes (small radius cuts)	Single-wire systems cut larger radius only
Equipment Cost	Generally more expensive and complex	Less expensive, easier to operate
애플리케이션	High-volume material slicing (e.g., silicon wafers)	High-precision slicing (e.g., sapphire, optics)

Process Principles of Diamond Wire Cutting

다이아몬드 와이어 커팅 works on the abrasive grinding principle, where the wire, coated with synthetic diamonds, moves at high speeds to remove material by grinding instead of shearing. This process results in high precision with minimal material deformation.

Key Mechanism of Diamond Wire Cutting

The process utilizes diamond abrasives on the wire to cut materials at high speed. The tension system maintains a consistent force on the wire, ensuring stable and precise cutting. The wire’s 빠른 선형 속도(최대 80m/s) is maintained for consistent material removal, allowing for ultra-fine surface finishes and narrow kerf widths (down to 0.35mm).

Endless Loop System vs. Spool Wire System

1. Endless Loop System (Ring-type)

   • 그만큼 endless (loop-type) wire saw system uses a closed loop of wire that continuously rotates in one direction. This system allows for higher linear speeds, which results in faster cutting 그리고 improved surface finish.

   • The key advantage of the loop system is that there is no reversal motion of the wire, unlike spool systems. This results in smoother cuts 와 함께 less vibration, leading to higher cutting precision.

   • Because of the high linear speed 그리고 안정적인 장력 within the loop, cutting performance improves, making it ideal for high-value and precision materials like 사파이어, 광학 유리및 advanced ceramics.

2. Spool Wire System (Reel-type)

   • Spool wire cutting systems involve wire wound on a spool that is uncoiled and moved back and forthacross the material (reciprocating motion). This results in lower wire speeds compared to loop-type systems.

   • 필요성 directional switching causes the cutting process to be slower, and the material is subject to more vibration, often resulting in cutting defects 그리고 visible direction marks on the surface.

   • Multiple wire systems (up to 200 wires at once) in spool wire saws allow for high-volume cutting but with less precision compared to loop systems.

Cutting Speed & Surface Finish: A Comparison

• Loop-type (Endless Wire): Faster cutting speeds, smoother surface finishes, less material distortion, and reduced kerf loss. Ideal for precision and high-value materials where the surface finish is critical.

• Reel-type (Spool Wire): Lower cutting speed due to the back-and-forth motion, which results in direction marks on the material. Though suitable for bulk cutting, it is less efficient in terms of cutting speed and surface quality.

Heat Generation in Diamond Wire Cutting

While diamond wire cutting is often referred to as a “cold cutting” process due to its low thermal impact, it’s important to note that some heat is still generated during the process. The small contact area between the wire and material minimizes frictional heat generation, but heat is still produced due to the high-speed interaction of the wire and material, especially under high feed rates or with tougher materials.

The key difference is that this heat is localized 그리고 minimized compared to traditional cutting methods like 레이저 커팅또는 band saws, which can generate more substantial thermal effects. In diamond wire cutting, this reduced heat prevents 열 손상, cracking또는 delamination in sensitive materials such as 사파이어 그리고 silicon.

Visualizing the Process of How Diamond Wire Cutting Work

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Materials Compatible with Diamond Wire Cutting

Diamond wire cutting can theoretically process any material with hardness lower than diamond, making it one of the most versatile precision-cutting technologies in the industry. Because the cutting mechanism is based on abrasive grinding, not thermal melting or mechanical shearing, it is particularly suitable for hard, brittle, high-value, and crystal-structured materials.
In industrial practice, diamond wire cutting is widely used in four major material categories

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Crystalline & Semiconductor Materials

Diamond wire cutting is the preferred method for slicing brittle crystalline materials due to its low thermal impact and extremely fine kerf.

Typical materials include:

• Monocrystalline silicon (Si) — Semiconductor wafers, solar wafers

• 게르마늄(Ge) — Infrared optics & sensors

• Gallium arsenide (GaAs) — RF components, infrared lasers

• 질화갈륨(GaN) — Power electronics, LED devices

• Sapphire (Al₂O₃ single crystal) — LED substrates, optical windows

• 석영 및 용융 실리카 — High-precision optics

Carbon-Based and Powder Metallurgy Materials

Diamond wire cutting is also widely used in carbon materials, graphite composites, and sintered metals, where precise geometry and smooth surfaces are required.

Typical materials:

• High-density graphite blocks — Evaporation boats, EDM electrodes, vacuum furnace parts

• Carbon-fiber reinforced materials (CFRP) — Aerospace components

• Powder metallurgy parts — Hard sintered materials requiring post-processing

• Tungsten carbide composites (WC-based PM) — Requires thin kerf and low residual stress

Industrial Technical Ceramics

Diamond wire cutting is commonly used to slice advanced engineering ceramics, which traditional saws cannot process without cracking.

Typical ceramic materials:

• Alumina ceramics (Al₂O₃) — Wear-resistant and electrical-insulation parts

• Zirconia ceramics (ZrO₂) — High-strength structural components

• 탄화규소(SiC) — Semiconductor process equipment, heat sinks

• Silicon nitride (Si₃N₄) — Aerospace and ball bearing components

• Lithium tantalate / niobate (LiTaO₃ / LiNbO₃) — Electro-optic crystals

Precious & High-Value Metals and Alloys

Although metals are not the primary focus, diamond wire cutting is used effectively for expensive or difficult-to-machine metals, especially when a narrow kerf or minimal material waste is required.

Examples include:

• Nickel-based superalloys (e.g., Inconel)

• Titanium and titanium alloys

• Molybdenum plates

• Precious metals (gold alloys, platinum alloys)

• Rare-earth magnetic materials

Demonstration Videos of Diamond Wire Cutting

Graphite-Diamond Wire Cutting


Crystal-Diamond Wire Cutting


Ceramic-Diamond Wire Cutting


Metal-Diamond Wire Cutting

All Diamond Wire Saw Products

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FAQ For Diamond Wire Cutting

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How do wire speed and tension affect surface quality?

*Higher wire speed improves grinding efficiency and reduces surface scratches, while stable tension (150–250 N) minimizes vibration. Low tension causes waviness and chatter marks; excessive tension increases risk of wire breakage.

Why is diamond wire cutting considered a low-stress and low-temperature process?

*The wire contacts the material along a narrow line, reducing frictional heat and limiting thermal expansion. Although some heat is generated, the temperature rise is minimal, preventing cracks or deformation in brittle materials such as sapphire or alumina.

what is your opening hours?

*Initial one-to-one consultation, Health & Fitness Assasments Bespoke training program planing, Custom Nutrition plan & recipes. Weekly Progress Reviews

What is the optimal wire speed for high-quality cutting?

*For most brittle crystalline materials, the optimal wire speed is 50~80m/s. Higher speeds improve material removal efficiency but require stable tension and precise alignment of guide wheels.

What causes wire vibration, and how can it be avoided?

*Wire vibration is usually caused by incorrect tension, worn grooves, or improper wheel alignment. Maintaining stable tension, using intact guide grooves, and ensuring clean coolant flow significantly reduces vibration.

Why is diamond wire cutting preferred for high-value materials such as sapphire and semiconductor crystals?

*It offers:

• Minimal subsurface damage

• Low kerf loss (cost saving)

• 매끄러운 절단면

• Consistent thickness across the entire cut

• Cold and low-stress processing

This combination makes it ideal for expensive materials where yield and quality are critical.