DESKTOP WIRE CUTTING MACHINE
Le SGR15 is a compact, high-precision desktop wire cutting machine designed for advanced slicing and contour cutting of optical glass, ceramics, and brittle materials. Built with four-axis control (X, Y, and dual rotation axes), it enables accurate multi-faceted cuts and programmable geometric shaping on small to medium-sized parts.
CARACTÉRISTIQUES PRINCIPALES
1. Four-Axis Control System
SGR15 is equipped with X and Y axis automatic feed plus two rotary axes, supporting complex polygon cutting and programmable multi-angle slicing.
2. Desktop Compact Structure
Designed as a benchtop model, the machine saves space while maintaining high rigidity and performance—perfect for lab benches or cleanroom use.
3. Diamond Wire Precision Cutting
Utilizes endless diamond wire loop technology for low-kerf, low-chipping, and high-quality surface results, even on fragile materials.
4. CNC Graphic Programming
Supports DXF file import and contour path customization, enabling precision machining of irregular geometries.
5. Touchscreen Operation Interface
User-friendly HMI for setting feed speeds, angles, wire tension, and automatic slicing cycles.
6. Integrated Cooling & Lubrication System
Comes with water cooling, automatic lubrication, and mist collection for clean and efficient processing.
Paramètre | Spécifications |
|---|---|
| Model | SGR15 |
| Machine Structure | Gantry |
| Total Weight | 140 kg |
| Taille de la machine | 665 × 690 × 750 mm |
| Axis Stroke (Y × Z) | 210 × 140 mm |
| Diamètre de coupe maximum | Ø150 mm |
| Max Cutting Height | 100 mm |
| Loading Capacity | 10 kg |
| Cutting Efficiency | 0.1–100 mm/min |
| Cutting Accuracy | ±0.05 mm |
| Repeatability | ±0,01 mm |
| Surface Roughness | 0.2 mm |
| Driving Mode | Stepper motor |
| Tension System | Spring |
| Auto Slicing | Oui |
| Angle Cutting | Oui |
| Complex Shape Cutting | Oui |
| Broken Wire Protection | Oui |
| Power Consumption | 1.3 kW |
| Source de courant | 220V, 50–60 Hz |
Steps for Operating the Device:
Wire Blade Installation:
- Loosen the tension handle to install the diamond wire blade around the driven and guiding wheels.
Sample Preparation:
- Heat the sample and use wax or epoxy to bond it onto a graphite/aluminum plate.
- Secure the plate on the working stage using the vise or screws for stability.
Cutting Setup:
- Ensure proper power connection (AC 110-230V).
- Input cutting speed or open a CAD drawing in machine system.
Cutting Operation:
- Set all cutting parameters and click start.
Coolant:
- Always use proper cutting fluid (oil-based coolant) to prevent machine corrosion and ensure the blade runs efficiently.
Post-Cutting:
- Clean the machine after every use to prevent build-up and prolong its operational life.
Click here to learn more about the Coupe des boucles de fil.
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TYPICAL APPLICATIONS
Versatile Cutting for Research, Prototyping, and Custom Optics
The SGR15 is ideal for cutting tasks that require flexibility, accuracy, and a compact machine footprint. Its four-axis design enables precise multi-angle slicing and complex shape cutting across a wide range of hard and brittle materials.
🔹 Prism & Polygonal Optics
Shaping and slicing of small glass prisms, filters, and multi-facet components for optical instruments and custom lens assemblies.
🔹 Sapphire and Quartz Slicing
Accurate slicing of small-diameter rods and wafers (≤150 mm) into uniform discs with low chipping—used in optoelectronics and laser components.
🔹 Technical Ceramics Machining
Cutting alumina, AlN, and similar ceramics into thin plates or intricate geometries for electronic substrates, sensors, and RF applications.
🔹 Ultra-Thin Sample Preparation
Creating 0.2–1 mm precision wafers or segments from brittle materials for microscopy, MEMS devices, and scientific research.
🔹 Glass & Crystal R&D
Used by universities and labs for rapid prototyping and structure testing across optical, photovoltaic, and advanced material sectors.
We Have Another 2 Tabletop Wire Saw Models
Optoélectronique
Institut de recherche scientifique
Bijoux et produits de luxe
Industrie céramique
Industrie des semi-conducteurs
Quelle est l'épaisseur maximale que la machine peut traiter pour la découpe ?
Quelle est la différence entre cette scie à fil et ID SAW ?
Leurs outils de coupe diffèrent : l'un utilise un câble diamanté et l'autre une lame, ce qui fait de l'un une méthode de coupe flexible et de l'autre une approche de coupe rigide. En outre, les trancheuses à cercle intérieur limitent la taille de la pièce à un diamètre inférieur à celui de la lame, alors que la scie à câble SHINE OptiGantry n'a pas cette restriction.