From software to hardware and control systems, all core technologies are independently developed in-house. This ensures strong customization capability and stable, reliable equipment quality.
Cut hard and brittle materials such as silicon, sapphire, quartz glass, and graphite with minimal chipping
The endless diamond wire cutting machine uses a closed-loop diamond wire as the cutting tool. During high-speed unidirectional operation, the exposed diamond abrasives continuously micro-grind the workpiece surface, achieving efficient and low-damage cutting. With a stable wire speed of 60–80 m/s and no need for reversing, the process ensures a narrow kerf, smooth cutting surface, and no visible wire marks. This technology is particularly suitable for processing hard, brittle, and high-value materials.
Fused quartz, blue glass, filter glass, optical crystals (ZnS, ZnSe, germanium lenses, etc.).
Solar wafers, magnetic materials, ferrites, insulation materials.
Graphite, engineering plastics (PEEK, PPS, PTFE, Ultem), hard brittle ceramics, composites.
Fossils, petrified wood, gemstones, jade, and special synthetic materials for research.
PU insulation bricks, energy-efficient building materials, and large-size insulators.
Monocrystalline silicon, polycrystalline silicon, silicon carbide, sapphire, piezoelectric ceramics, germanium, etc.
These are some of our standard models, we also have about 100 models which is not listed on website.
QUARZGLAS-DRAHTSCHNEIDEMASCHINE
3D KONISCH GESCHNITTENE ENDLOSE DIAMANTDRAHTSÄGEMASCHINE
Schwenkbare Diamantdrahtschneidegeräte
GROSSFORMATIGE QUARZSÄGEMASCHINE
Ultra-große Diamant-Trennsäge
Best Seller Graphitdrahtsäge
Feature / Equipment | Endlos-Diamant-Seilsäge | Reciprocating Long Wire Saw | Innendurchmessersäge (ID-Säge) | Diamond Blade / Grinding Wheel | Diamantbandsäge |
---|---|---|---|---|---|
1 Cutting Tool | Closed-loop diamond wire (5–10 m) | Long reciprocating diamond wire (~1000 m) | Circular inner diameter blade | Diamond blade / grinding wheel | Continuous looped diamond band (20–100 m) |
2 Wire/Tool Motion | Continuous high-speed one-way (60–80 m/s) | Back-and-forth reciprocating | Rotating blade | Rotating blade/wheel | Continuous loop, slower linear speed (10–30 m/s) |
3 Cutting Speed | Very fast (no reversal) | Moderate (reversal limits speed) | Mittel | Fast for coarse cutting | Medium (limited by band speed) |
4 Cut Surface Quality | Smooth, no wire marks, minimal chipping | Acceptable, wire marks visible | Smooth but limited by blade thickness | Rough, post-processing often needed | Medium quality, band marks may remain |
5 Kerf Width | Narrow (0.35–0.6 mm) | Very narrow (0.1–0.6 mm) | Narrow (0.35–0.6 mm) | Wide (≥1.5 mm) | Medium (1.0–1.5 mm) |
6 Material Loss | Very low | Very low | Very low | Hoch | Mittel |
7 Material Compatibility | Anything softer than diamond | Mainly silicon, sapphire | Mainly silicon wafers, glass, magnets | General hard materials, coarse cuts | Stone, glass, ceramics, medium-hard brittle materials |
8 Cutting Capability | From 1 mm to 3 m workpiece (material thickness) | Normally 200–500 mm workpiece (material thickness) | Normally 50–100 mm workpiece (material thickness) | Normally 50–300 mm workpiece (material thickness) | From 1 mm to 3 m workpiece (material thickness) |
9 Shape Cutting | Supports slicing + complex shapes (CNC) | Mostly slicing | Mainly slicing | Simple straight/angle cuts | Curved shapes possible but rough |
10 Automation | High (multi-axis CNC, programmable feed) | Mittel | Mittel | Low–medium | Low–medium |
11 Customization Capability | Strong (in-house R&D, flexible) | Begrenzt | Begrenzt | Begrenzt | Begrenzt |
12 Typical Application | Semiconductor, optics, graphite, ceramics, R&D + production | Solar wafers, semiconductor wafers | Semiconductor wafers (thin slicing) | Construction, coarse cutting | Glass, ceramics, stone, general fabrication |
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Our equipment requires almost no after-sales service, because remote maintenance was considered from the initial design stage. Usually, only consumables need to be replaced, and with a comprehensive training system in place, the equipment receives consistently high customer satisfaction.
We have different machine models, click here to see model gallery
They can cut sapphire, silicon carbide, quartz, optical glass, graphite, and ceramics.Almost anything softer than diamond.
Cutting tolerance is within ±0.03mm, with with a sanding finish.
Yes, certain CNC models support multi-axis contour and angled cutting.
A wire loop usually lasts 5–7 days under normal 8-hour shifts.
Yes, we offer customization for worktable size, wire diameter, and functions.
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