Máy cắt dây kim cương không giới hạn

Perfect For Material Cut

diamond wiresaw
From entry level wire saw to complex customized wire saw

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-What We Offer

Unmatched Reliability for Every Project

From software to hardware and control systems, all core technologies are independently developed in-house. This ensures strong customization capability and stable, reliable equipment quality.

Outstanding Service Excellent Award

Cut hard and brittle materials such as silicon, sapphire, quartz glass, and graphite with minimal chipping

VImfun diamond wire saw manufacturer
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Graphite wire saw
-Materials Our Endless Diamond Wire Saw Cut

HardBrittle

The endless diamond wire cutting machine uses a closed-loop diamond wire as the cutting tool. During high-speed unidirectional operation, the exposed diamond abrasives continuously micro-grind the workpiece surface, achieving efficient and low-damage cutting. With a stable wire speed of 60–80 m/s and no need for reversing, the process ensures a narrow kerf, smooth cutting surface, and no visible wire marks. This technology is particularly suitable for processing hard, brittle, and high-value materials.

Optical and Glass Materials:

Fused quartz, blue glass, filter glass, optical crystals (ZnS, ZnSe, germanium lenses, etc.).

New Energy and Functional Materials

Solar wafers, magnetic materials, ferrites, insulation materials.

High-Performance Engineering Materials

Graphite, engineering plastics (PEEK, PPS, PTFE, Ultem), hard brittle ceramics, composites.

Special and High-Value Materials

Fossils, petrified wood, gemstones, jade, and special synthetic materials for research.

Construction and Energy-Saving Materials

PU insulation bricks, energy-efficient building materials, and large-size insulators.

Semiconductor and Electronic Materials

Monocrystalline silicon, polycrystalline silicon, silicon carbide, sapphire, piezoelectric ceramics, germanium, etc.

 

Flexible Options, Popular Models.

These are some of our standard models, we also have about 100 models which is not listed on website.

——Contact Us Directly

Experts in Cutting Equipment Solutions.

Cutting Equipment Comparison

Feature / Equipment Cưa dây kim cương vô tận Traditional Diamond Wire Saw Cưa đường kính trong (Cưa ID) Diamond Blade / Grinding Wheel Máy cưa vòng kim cương
1 Cutting Tool Closed-loop diamond wire (5–10 m) Long Spooled reciprocating diamond wire (~1000 m) Circular inner diameter blade Diamond blade / grinding wheel Closed-loop diamond band (20–100 m)
2 Wire/Tool Motion Continuous high-speed one-way liner speed (60–80 m/s) Back-and-forth reciprocating Rotating blade Rotating blade/wheel Continuous, slower linear speed (10–30 m/s)
3 Cutting Speed Very fast (no reversal) Moderate (reversal limits speed) Trung bình Fast for coarse cutting Medium (limited by band speed)
4 Cut Surface Quality Smooth, no wire marks, minimal chipping Acceptable, wire marks visible Smooth but limited by blade thickness Rough, post-processing often needed Medium quality, band marks may remain
5 Kerf Width Narrow (0.35–0.6 mm) Very narrow (0.1–0.6 mm) Narrow (0.35–0.6 mm) Wide (≥1.5 mm) Medium (1.0–1.5 mm)
6 Material Loss low Very low low Cao Trung bình
7 Material Compatibility Anything softer than diamond Mainly silicon wfers, sapphire wafers Mainly glass, magnets General hard materials, coarse cuts Stone, glass, ceramics, medium-hard brittle materials
8 Cutting Capability From 1 mm to 3 m workpiece (material thickness) Normally 200–500 mm workpiece (material thickness) Normally 50–100 mm workpiece (material thickness) Normally 50–300 mm workpiece (material thickness) From 1 mm to 3 m workpiece (material thickness)
9 Shape Cutting Supports slicing + complex shapes (CNC) Mostly slicing Mainly slicing Simple straight/angle cuts Curved shapes possible but rough
10 Automation High (multi-axis CNC, programmable feed) Trung bình Trung bình Low–medium Low–medium
11 Customization Capability Strong (in-house R&D, flexible) Limited Limited Limited Limited
12 Typical Application Semiconductor, optics, graphite, ceramics, R&D + production Solar wafers, semiconductor wafers Semiconductor wafers (thin slicing) Construction, coarse cutting Glass, ceramics, stone, general metal fabrication

Scroll horizontally on small screens to view all columns.


——What our clients say


Client Confidence Speaks

 

Our equipment requires almost no after-sales service, because remote maintenance was considered from the initial design stage. Usually, only consumables need to be replaced, and with a comprehensive training system in place, the equipment receives consistently high customer satisfaction.

Máy cắt dây kim cương Vimfun
Máy cắt dây kim cương Vimfun
Máy cắt dây kim cương Vimfun
Máy cắt dây kim cương Vimfun
Máy cắt dây kim cương Vimfun
Máy cắt dây kim cương Vimfun
Máy cắt dây kim cương Vimfun
Máy cắt dây kim cương Vimfun
250-40 vimfun wire saw

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We have different machine models, click here to see model gallery

Câu hỏi thường gặp

Quick Answers, Quick Solutions.

What types of materials can your diamond wire cutting machines process?

They can cut sapphire, silicon carbide, quartz, optical glass, graphite, and ceramics.Almost anything softer than diamond.

Cutting tolerance is within ±0.03mm, with with a sanding finish.

Yes, certain CNC models support multi-axis contour and angled cutting.

A wire loop usually lasts 5–7 days under normal 8-hour shifts.

Yes, we offer customization for worktable size, wire diameter, and functions.

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