Бесконечный алмазный станок для резки проволоки

Perfect For Material Cut

Vimfun алмазная проволока пила машина
From entry level wire saw to complex customized wire saw

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-What We Offer

Unmatched Reliability for Every Project

From software to hardware and control systems, all core technologies are independently developed in-house. This ensures strong customization capability and stable, reliable equipment quality.

Outstanding Service Excellent Award

Cut hard and brittle materials such as silicon, sapphire, quartz glass, and graphite with minimal chipping

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Vimfun алмазная проволока пила машина
-Materials Our Endless Diamond Wire Saw Cut

HardBrittle

The endless diamond wire cutting machine uses a closed-loop diamond wire as the cutting tool. During high-speed unidirectional operation, the exposed diamond abrasives continuously micro-grind the workpiece surface, achieving efficient and low-damage cutting. With a stable wire speed of 60–80 m/s and no need for reversing, the process ensures a narrow kerf, smooth cutting surface, and no visible wire marks. This technology is particularly suitable for processing hard, brittle, and high-value materials.

Optical and Glass Materials:

Fused quartz, blue glass, filter glass, optical crystals (ZnS, ZnSe, germanium lenses, etc.).

New Energy and Functional Materials

Solar wafers, magnetic materials, ferrites, insulation materials.

High-Performance Engineering Materials

Graphite, engineering plastics (PEEK, PPS, PTFE, Ultem), hard brittle ceramics, composites.

Special and High-Value Materials

Fossils, petrified wood, gemstones, jade, and special synthetic materials for research.

Construction and Energy-Saving Materials

PU insulation bricks, energy-efficient building materials, and large-size insulators.

Semiconductor and Electronic Materials

Monocrystalline silicon, polycrystalline silicon, silicon carbide, sapphire, piezoelectric ceramics, germanium, etc.

 

Flexible Options, Popular Models.

These are some of our standard models, we also have about 100 models which is not listed on website.

——Contact Us Directly

Experts in Cutting Equipment Solutions.

Cutting Equipment Comparison

Feature / EquipmentПила с бесконечной алмазной проволокойReciprocating Long Wire SawПила по внутреннему диаметру (ID Saw)Diamond Blade / Grinding WheelАлмазная ленточная пила
1 Cutting ToolClosed-loop diamond wire (5–10 m)Long reciprocating diamond wire (~1000 m)Circular inner diameter bladeDiamond blade / grinding wheelContinuous looped diamond band (20–100 m)
2 Wire/Tool MotionContinuous high-speed one-way (60–80 m/s)Back-and-forth reciprocatingRotating bladeRotating blade/wheelContinuous loop, slower linear speed (10–30 m/s)
3 Cutting SpeedVery fast (no reversal)Moderate (reversal limits speed)СреднийFast for coarse cuttingMedium (limited by band speed)
4 Cut Surface QualitySmooth, no wire marks, minimal chippingAcceptable, wire marks visibleSmooth but limited by blade thicknessRough, post-processing often neededMedium quality, band marks may remain
5 Kerf WidthNarrow (0.35–0.6 mm)Very narrow (0.1–0.6 mm)Narrow (0.35–0.6 mm)Wide (≥1.5 mm)Medium (1.0–1.5 mm)
6 Material LossVery lowVery lowVery lowВысокийСредний
7 Material CompatibilityAnything softer than diamondMainly silicon, sapphireMainly silicon wafers, glass, magnetsGeneral hard materials, coarse cutsStone, glass, ceramics, medium-hard brittle materials
8 Cutting CapabilityFrom 1 mm to 3 m workpiece (material thickness)Normally 200–500 mm workpiece (material thickness)Normally 50–100 mm workpiece (material thickness)Normally 50–300 mm workpiece (material thickness)From 1 mm to 3 m workpiece (material thickness)
9 Shape CuttingSupports slicing + complex shapes (CNC)Mostly slicingMainly slicingSimple straight/angle cutsCurved shapes possible but rough
10 AutomationHigh (multi-axis CNC, programmable feed)СреднийСреднийLow–mediumLow–medium
11 Customization CapabilityStrong (in-house R&D, flexible)ОграниченныйОграниченныйОграниченныйОграниченный
12 Typical ApplicationSemiconductor, optics, graphite, ceramics, R&D + productionSolar wafers, semiconductor wafersSemiconductor wafers (thin slicing)Construction, coarse cuttingGlass, ceramics, stone, general fabrication

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——What our clients say


Client Confidence Speaks

 

Our equipment requires almost no after-sales service, because remote maintenance was considered from the initial design stage. Usually, only consumables need to be replaced, and with a comprehensive training system in place, the equipment receives consistently high customer satisfaction.

Vimfun алмазная проволока пила машина
Vimfun алмазная проволока пила машина
Vimfun алмазная проволока пила машина
Vimfun алмазная проволока пила машина
Vimfun алмазная проволока пила машина
Vimfun алмазная проволока пила машина
Vimfun алмазная проволока пила машина
Vimfun алмазная проволока пила машина
250-40 vimfun wire saw

Choose Quality Choose Us!

We have different machine models, click here to see model gallery

Часто задаваемые вопросы

Quick Answers, Quick Solutions.

What types of materials can your diamond wire cutting machines process?

They can cut sapphire, silicon carbide, quartz, optical glass, graphite, and ceramics.Almost anything softer than diamond.

Cutting tolerance is within ±0.03mm, with with a sanding finish.

Yes, certain CNC models support multi-axis contour and angled cutting.

A wire loop usually lasts 5–7 days under normal 8-hour shifts.

Yes, we offer customization for worktable size, wire diameter, and functions.

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