끝없는 다이아몬드 와이어 절단기
Perfect For Material Cut
From entry level wire saw to complex customized wire saw
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-What We Offer
Unmatched Reliability for Every Project
From software to hardware and control systems, all core technologies are independently developed in-house. This ensures strong customization capability and stable, reliable equipment quality.
Outstanding Service Excellent Award
Cut hard and brittle materials such as silicon, sapphire, quartz glass, and graphite with minimal chipping
- 20+ years proven industry expertise
- 맞춤형 엔지니어링 기능
- 원격 모니터링 및 진단
-Materials Our Endless Diamond Wire Saw Cut
HardBrittle
The endless diamond wire cutting machine uses a closed-loop diamond wire as the cutting tool. During high-speed unidirectional operation, the exposed diamond abrasives continuously micro-grind the workpiece surface, achieving efficient and low-damage cutting. With a stable wire speed of 60–80 m/s and no need for reversing, the process ensures a narrow kerf, smooth cutting surface, and no visible wire marks. This technology is particularly suitable for processing hard, brittle, and high-value materials.
Optical and Glass Materials:
Fused quartz, blue glass, filter glass, optical crystals (ZnS, ZnSe, germanium lenses, etc.).
New Energy and Functional Materials
Solar wafers, magnetic materials, ferrites, insulation materials.
High-Performance Engineering Materials
Graphite, engineering plastics (PEEK, PPS, PTFE, Ultem), hard brittle ceramics, composites.
Special and High-Value Materials
Fossils, petrified wood, gemstones, jade, and special synthetic materials for research.
Construction and Energy-Saving Materials
PU insulation bricks, energy-efficient building materials, and large-size insulators.
Semiconductor and Electronic Materials
Monocrystalline silicon, polycrystalline silicon, silicon carbide, sapphire, piezoelectric ceramics, germanium, etc.
Flexible Options, Popular Models.
These are some of our standard models, we also have about 100 models which is not listed on website.
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Experts in Cutting Equipment Solutions.
Cutting Equipment Comparison
| Feature / Equipment | 끝없는 다이아몬드 와이어 톱 | Reciprocating Long Wire Saw | 내경 톱(ID 톱) | Diamond Blade / Grinding Wheel | 다이아몬드 띠톱 |
|---|---|---|---|---|---|
| 1 Cutting Tool | Closed-loop diamond wire (5–10 m) | Long reciprocating diamond wire (~1000 m) | Circular inner diameter blade | Diamond blade / grinding wheel | Continuous looped diamond band (20–100 m) |
| 2 Wire/Tool Motion | Continuous high-speed one-way (60–80 m/s) | Back-and-forth reciprocating | Rotating blade | Rotating blade/wheel | Continuous loop, slower linear speed (10–30 m/s) |
| 3 Cutting Speed | Very fast (no reversal) | Moderate (reversal limits speed) | 중간 | Fast for coarse cutting | Medium (limited by band speed) |
| 4 Cut Surface Quality | Smooth, no wire marks, minimal chipping | Acceptable, wire marks visible | Smooth but limited by blade thickness | Rough, post-processing often needed | Medium quality, band marks may remain |
| 5 Kerf Width | Narrow (0.35–0.6 mm) | Very narrow (0.1–0.6 mm) | Narrow (0.35–0.6 mm) | Wide (≥1.5 mm) | Medium (1.0–1.5 mm) |
| 6 Material Loss | Very low | Very low | Very low | 높은 | 중간 |
| 7 Material Compatibility | Anything softer than diamond | Mainly silicon, sapphire | Mainly silicon wafers, glass, magnets | General hard materials, coarse cuts | Stone, glass, ceramics, medium-hard brittle materials |
| 8 Cutting Capability | From 1 mm to 3 m workpiece (material thickness) | Normally 200–500 mm workpiece (material thickness) | Normally 50–100 mm workpiece (material thickness) | Normally 50–300 mm workpiece (material thickness) | From 1 mm to 3 m workpiece (material thickness) |
| 9 Shape Cutting | Supports slicing + complex shapes (CNC) | Mostly slicing | Mainly slicing | Simple straight/angle cuts | Curved shapes possible but rough |
| 10 Automation | High (multi-axis CNC, programmable feed) | 중간 | 중간 | Low–medium | Low–medium |
| 11 Customization Capability | Strong (in-house R&D, flexible) | 제한적 | 제한적 | 제한적 | 제한적 |
| 12 Typical Application | Semiconductor, optics, graphite, ceramics, R&D + production | Solar wafers, semiconductor wafers | Semiconductor wafers (thin slicing) | Construction, coarse cutting | Glass, ceramics, stone, general fabrication |
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——What our clients say
Client Confidence Speaks
Our equipment requires almost no after-sales service, because remote maintenance was considered from the initial design stage. Usually, only consumables need to be replaced, and with a comprehensive training system in place, the equipment receives consistently high customer satisfaction.
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We have different machine models, click here to see model gallery
자주 묻는 질문
Quick Answers, Quick Solutions.
What types of materials can your diamond wire cutting machines process?
They can cut sapphire, silicon carbide, quartz, optical glass, graphite, and ceramics.Almost anything softer than diamond.
What is the typical cutting tolerance and surface finish quality?
Cutting tolerance is within ±0.03mm, with with a sanding finish.
Can the machines cut complex shapes or only straight slices?
Yes, certain CNC models support multi-axis contour and angled cutting.
How long does one diamond wire loop typically last during cutting?
A wire loop usually lasts 5–7 days under normal 8-hour shifts.
Can the worktable and cutting system be customized for different material sizes and processes?
Yes, we offer customization for worktable size, wire diameter, and functions.
